All 23+ platforms — from RK2108D voice modules to RK3588 AI flagships, from ECG patches to the 60-TOPS ZNAS — are available for ODM joint design or OEM rebranding. You bring the market, we bring the engineering.
From a one-line requirement to certified mass production.
Share target function, quantity and unit cost. Feasibility note + BOM-level quotation range within 1 business day. NDA before detailed specs.
Industrial design, mechanical tooling, schematic + PCB layout on Rockchip / Zesai platforms. DFM reviews at every gate.
Linux/Android/RTOS firmware, on-device LLM (RKLLM 7B-27B), RAG knowledge bases, voice pipelines, white-label mobile apps.
CE/FCC/RoHS/CCC for consumer; IEC 60601 + ISO 13485 processes and FDA 510(k)/EU MDR documentation for medical.
Shenzhen NPI → Dongguan SMT. AOI/ICT/assembly test, traceable serial numbers, 50K+ boards and 20K+ finished units per month.
Multi-source BOM policy, long-term availability commitments, firmware OTA and end-of-life migration paths.
Custom PCB dimensions and interfaces, stamp-hole/LGA/edge connectors, plastic or metal enclosures with your ID, IP65/IP67 sealing, colors and surface finish.
Boot logo, UI themes, interface languages, feature flags, OTA channels. White-label iOS/Android apps and WeChat mini-programs.
On-device LLM selection and quantization, private RAG corpora, wake words, voice personas, cloud LLM bridges (ChatGPT/Doubao/Qwen/DeepSeek).
Silk-screen and laser logos, custom retail boxes, quick-start guides in your language, barcode/IMEI labeling.
Pre-certified platforms shorten your approval cycle; we support regional radio modules (SRRC/FCC/CE) and medical documentation.
FOB Shenzhen / DDP to your warehouse, drop-shipping, or ODM supply to your factory. Flexible lead-time buffers.
The questions procurement and product teams ask before starting an ODM project.
Yes. All 23+ products on metoclaw.com — core boards, industrial PDAs, medical devices, AI robots, HiFi audio, smart thermostats, and the ZNAS AI NAS — are available for ODM (joint design) or OEM (rebranding) production. We customize firmware, enclosure, logo, packaging, certifications, and interface languages.
OEM rebranding starts at 100-500 units depending on the product. Full ODM with custom enclosure and PCB layout typically starts at 1,000-3,000 units. Engineering samples (3-10 units) are available for evaluation.
Firmware/logo rebrand: 2-4 weeks. Custom enclosure (ID/MD): 8-14 weeks including tooling. Full custom hardware: 16-24 weeks from schematic review to MP (mass production).
We build primarily on Rockchip (RK2108D, RK3506, RK3566/RK3568, RK3399Pro, RK3576, RK3588) and Zesai AFEs for medical wearables. Our iCore-1828 M.2 AI module adds up to 18 TOPS NPU compute to any host platform. RISC-V and other platforms are available on request.
Yes. Our medical line (ECG patches, 12-lead Holter, disposable SpO2) is built for IEC 60601 and ISO 13485 processes, and consumer products carry CE/FCC/RoHS/CCC. We support FDA 510(k) documentation, EU MDR technical files, and regional certifications for ODM partners.
Yes. Our embedded stack covers OpenWrt/Debian Linux, Android, and RTOS, with on-device LLM deployment (RKLLM, 7B-27B models), RAG knowledge bases, voice pipelines (far-field mics, beamforming, AEC), and cloud bridges to major LLM APIs. White-label apps for iOS/Android/WeChat mini-programs are available.
Design and NPI in Shenzhen (MeToclaw / Shenzhen METO Technology Co., Ltd.), with volume production through our Dongguan SMT partners. Monthly capacity: 50K+ core boards, 20K+ finished units, with AOI/ICT/full-assembly test and traceable serial numbers.
Email your requirements (target function, quantity, target unit cost, timeline) via the Contact page. We reply within 1 business day with a feasibility note, a BOM-level quotation range, and an NDA for detailed specifications.
We reply with feasibility, a BOM-level quotation range, and an NDA. No obligation.
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